Due to its improved branch prediction, bigger buffer sizes (1500 instead of 1000 entries in the L2 TLB) and other tweaks, the performance per clock has been increased by more than 5 percent over its predecessor. The Core i3 is manufactured in a 14 nm process with FinFET transistors.īroadwell represents the 'Tick' in Intel's Tick-Tock model, which means a shrink of its predecessor Haswell. The new 14 nm manufacturing process with three-dimensional FinFET transistors allows not only improvements in energy efficiency, but also a significantly smaller die size fit for more compact packages and devices.įurther advantages result from the revised microarchitecture of Broadwell. In addition to two CPU cores with Hyper-Threading clocked at 2.5 GHz (no Turbo), the chip also integrates an Iris Graphics 6100 GPU and a dual-channel LPDDR3-1866/DDR3L-1600 memory controller. With a TDP of 28 W, the CPU is suited for medium-sized ultrabooks and notebooks, whereas smaller devices will use more power efficient ULV models such as the Core i3-5010U (15 W TDP). The Intel Core i3-5157U is a fast dual-core processor based on the Broadwell architecture, which has been launched in January 2015. Intel Core i3-5157U ► remove from comparison

Intel pentium silver n5000